\relax 
\citation{Xie_3D}
\citation{Xie_3D1}
\citation{tezzaron}
\citation{Jing_3D}
\citation{Jing:cost}
\citation{KGS}
\citation{tezzaron}
\citation{KGS}
\citation{3D_wireless_test}
\citation{Jing:TSV}
\citation{BIST}
\citation{Jing:IMEC}
\citation{Jing:redundancy}
\citation{Jing:IMEC}
\@writefile{toc}{\contentsline {section}{\numberline {I}Introduction}{1}}
\@writefile{toc}{\contentsline {section}{\numberline {II}The Proposed Methodology and Mechanism}{1}}
\citation{Jing:IMEC}
\citation{Jing:testbook}
\citation{Jing:Xiaoxia}
\citation{TSVstress}
\citation{TSVmobility}
\citation{tsvmodel}
\@writefile{toc}{\contentsline {subsection}{\numberline {\unhbox \voidb@x \hbox {II-A}}Time-Efficient Testing Flow}{2}}
\@writefile{toc}{\contentsline {subsection}{\numberline {\unhbox \voidb@x \hbox {II-B}}Circuit Level Consideration of Design for Testing}{2}}
\@writefile{lof}{\contentsline {figure}{\numberline {1}{\ignorespaces \relax \fontsize  {9}{10pt}\selectfont  {Die stacking scheme and test order.}\relax }}{2}}
\providecommand*\caption@xref[2]{\@setref\relax\@undefined{#1}}
\newlabel{fig:1}{{1}{2}}
\@writefile{lof}{\contentsline {figure}{\numberline {2}{\ignorespaces \relax \fontsize  {9}{10pt}\selectfont  {Timing efficient stacking and test flow. N is the number of 3D stacking layers.}\relax }}{2}}
\newlabel{fig:2}{{2}{2}}
\citation{Wu2011}
\citation{Jing:IMEC}
\citation{Jing:IMEC}
\@writefile{lof}{\contentsline {figure}{\numberline {3}{\ignorespaces \relax \fontsize  {9}{10pt}\selectfont  {TSV test chain. One cluster of TSVs are connected together by MUX and FF. The Test Block will generatea the select signal of all the MUX and result of defect TSV locations. }\relax }}{3}}
\newlabel{fig:3}{{3}{3}}
\@writefile{toc}{\contentsline {subsection}{\numberline {\unhbox \voidb@x \hbox {II-C}}Yield Modeling and Defect Searching Algorithm}{3}}
\@writefile{lof}{\contentsline {figure}{\numberline {4}{\ignorespaces \relax \fontsize  {9}{10pt}\selectfont  {TSV circuit model}\relax }}{3}}
\newlabel{fig:tsv}{{4}{3}}
\@writefile{loa}{\contentsline {algocf}{\numberline {1}{\ignorespaces Find Redundant TSV number\relax }}{4}}
\newlabel{alg1}{{1}{4}}
\@writefile{loa}{\contentsline {algocf}{\numberline {2}{\ignorespaces Breadth First Binary Search of TSV defects\relax }}{4}}
\newlabel{alg2}{{2}{4}}
\@writefile{toc}{\contentsline {section}{\numberline {III}Experimental results}{4}}
\@writefile{lof}{\contentsline {figure}{\numberline {5}{\ignorespaces \relax \fontsize  {9}{10pt}\selectfont  {TSV yield map}\relax }}{5}}
\newlabel{fig:map}{{5}{5}}
\@writefile{lof}{\contentsline {figure}{\numberline {6}{\ignorespaces \relax \fontsize  {9}{10pt}\selectfont  {Relationship of TSV cluster yield and number of redundant TSVs required to reach 98\% TSV cluster yield}\relax }}{5}}
\newlabel{fig:yield}{{6}{5}}
\bibstyle{ieeetr}
\bibdata{3Dtest}
\bibcite{Xie_3D}{1}
\bibcite{Xie_3D1}{2}
\bibcite{tezzaron}{3}
\bibcite{Jing_3D}{4}
\bibcite{Jing:cost}{5}
\bibcite{KGS}{6}
\bibcite{3D_wireless_test}{7}
\bibcite{Jing:TSV}{8}
\bibcite{BIST}{9}
\bibcite{Jing:IMEC}{10}
\bibcite{Jing:redundancy}{11}
\bibcite{Jing:testbook}{12}
\bibcite{Jing:Xiaoxia}{13}
\bibcite{TSVstress}{14}
\bibcite{TSVmobility}{15}
\bibcite{tsvmodel}{16}
\bibcite{Wu2011}{17}
\@writefile{lof}{\contentsline {figure}{\numberline {7}{\ignorespaces \relax \fontsize  {9}{10pt}\selectfont  {Comparison of average test time (top row) and yield after applied redundancy (bottom row) for several schemes. The X axis represents the TSV cluster yield before applied redundancy. (A) One redundant TSV placed in the center of the cluster; (B) One redundant TSV placed at the edge of the cluster; (C) Three redundant TSVs placed at the edge. Three cluster size were used in experiment, which is (black) 6x6 TSV cluster, (blue) 10x10 array, and (red) 16x16 array.}\relax }}{6}}
\newlabel{fig:yield2}{{7}{6}}
\@writefile{toc}{\contentsline {section}{\numberline {IV}Conclusion}{6}}
